半導體
非接觸金線檢查機
封裝完成後，利用電容耦合 Sensor 檢出 Bonding Wire 的 Wire-Close/短路，免探針、不傷樣品。
- 流程：選取被測接腳 → 施加訊號 → 讀取 Sensor訊號 → 與基準訊號數據比對 → 輸出 Pass/Fail。
- 優勢：非接觸、快速掃描、可量產導入，提升終檢良率與追溯效率。
- 適用：WB BGA IC、Molding制程檢驗、密線區封裝之出貨終檢與 FA 驗證
non-contact bunding wire ispection system.
AFTER PACKAGING IS COMPLETED,
A CAPACITIVE-COUPLING SENSOR DETECTS BONDING-WIRE”WIRE-CLOSE
“/SHORT DEFECTS-PROBE-LESS AND
NON-DESTRUCTIVE.
A CAPACITIVE-COUPLING SENSOR DETECTS BONDING-WIRE”WIRE-CLOSE
“/SHORT DEFECTS-PROBE-LESS AND
NON-DESTRUCTIVE.
• PROCESS:
Select target pin → apply signal → read sensor output → compare to →output PASS/FAIL.
Select target pin → apply signal → read sensor output → compare to →output PASS/FAIL.
• Advantages:
Non-contact, fast scanning, production-line ready; improves final-test yield and traceability.
Non-contact, fast scanning, production-line ready; improves final-test yield and traceability.
• Applications:
Wire-bonded BGA ICs; post-molding inspection; outgoing final test and FAverification for find pitch/high-density wire-bond packages.
Wire-bonded BGA ICs; post-molding inspection; outgoing final test and FAverification for find pitch/high-density wire-bond packages.