IC載板
盲孔檢測設備
【開發背景】
因應層數增加，盲孔品質對於AI產品運行的穩定及訊號耗損等的影響愈加明顯。現有盲孔檢查機速度無法進行全檢，為此我們開發具備更高掃描效率的新型檢查系統。
【技術亮點】
– 掃描速度高達 300 mm/s。
– 適用多種材料：ABF載板、CCL、PCB。
Laser Via Bottom AOI
【Development Background】
As substrate layer counts increase, blind via quality has a greater impact on AI system stability and signal integrity. Current inspection machines lack the speed required for full inspection. To address this, we developed a next-generation inspection system with significantly enhanced scanning efficiency.
【Technical Highlights】
-Scanning speed up to 300 mm/s.
-Compatible with various materials including ABF substrates, CCL, and PCB.