IC載板
專用治具製造能力
【開發背景】
客戶於電測與量測製程中所需的高精度治具,我們皆能提供客製化對應,協助其打造穩定製程平台。
【技術亮點】
– 可開發 BUMP 3D量測載台（精度 <1 μm）
– 提供各式高強度 玻璃材質治具與特殊應用治工具。
BUMP 3D MEASUREMENT JIG
【Development Background】
We offer fully customized high-precision fixtures required for electrical testing and metrology processes, supporting customers in building stable and reliable process platforms.
【Technical Highlights】
-Capable of developing BUMP 3D measurement platforms with precision <1 μm.
-Provides a variety of high-strength glass fixtures and tooling for special applications.