Interposer Embedded Inspection

In response to CoWoS packaging needs for high-end AI/CPU/GPU chips,we offer embedded interposer inspection solutions.

Core Technologies:

• Development of proprietary high-speed ASIC chips for precision measurement.
• Embedded LCR test modules for contact high-precision probing.
• Compensates for complex parasitic effects,  accurately and without interference, to enhance system stability.
• High-precision alignment for interposer bump sizes < 20 μm.