High Accuracy 3D Underfill Measurement

3D Inspection System

We offer a range of high-precision 3D inspection solutions for semiconductors and OSATs to meet any 3D inspection need in production.

System Features:

• Ultra-high resolution and high throughput detection (customizable to meet customer standards).
• 3μm Z-axis resolution can meet advanced process requirements.
• Real-time detection to prevent defects in the process.
• Quantitative data analysis to reduce false positives.
• 3D surface defect detection provides contour data.
• Use AI to assist defect classification to enhance auto-Inspection.
• Customizable device configurations and layouts.

application:

• Underfill width, height and fluidity of the bottom fill dispensing, and Inspection of surrounding components.
• warpage detection.
• Wire bond height and radian inspection.
• Bump height, size and coplanarity.
• SMT passive component tombstones / billboards and shift inspection.
• Socket pin abnormality, tin loss, and wear detection
• Measurement of any 3D object.