With superior dimensional stability, exceptional high-frequency/high-speed performance, and integration benefits for advanced packaging, glass core substrates have emerged as a critical roadmap for next-generation IC substrates. However, glass processing—including drilling, metallization, and high-temperature thermal cycles—imposes stringent tolerances on dimensional precision, via diameter/depth, profile deformation, and warpage control.Tailored to customer process development demands.
Centrum Technology Glass Substrate Metrology System provides a high-precision, high-efficiency inspection platform for high-speed dimensional, topographical, via (TGV), and thermal warpage metrology. Delivering reliable quantitative data, it empowers manufacturers to master new-material process stability and control critical quality indicators.
This solution is engineered for R&D validation, process development, and mass-production qualification, enabling early detection of processing deviations and reliability risks to accelerate glass substrate technology adoption.
- Multi-Dimensional Composite Precision Metrology:
Integrates critical dimension (CD), geometric profile, and TGV (through-glass via) diameter and depth measurement capabilities. - Advanced High-Temperature Warpage Metrology: Dynamically characterizes thermal stress behavior and substrate deformation across process temperature profiles.