WB-BGA Wire Skew Inspection after Molding

Reliable IC inspection targeting automotive-grade reliability standards.

• Final IC package inspection to detect internal wire misalignment issues.
• Utilizes a differentiated detection method compared to Keysight, demonstrating industry-leading performance in its class.
• Enhances post-shipment product reliability, reducing failure risk at the end user.
• Applicable to high-reliability ICs used in automotive (ATV) and similar applications.