Heating-open-short-tester

In advanced AI packaging processes, detecting IC substrate defects only after die assembly results in catastrophic losses of high-value dies, packaging materials, and valuable cycle time. As operational temperatures and reliability standards continue to rise, ambient electrical testing alone is no longer sufficient to reveal latent risks under actual working conditions.

Centrum Technology’s Thermal Electrical Tester is purpose-built for high-end IC substrate pre-testing, enabling electrical verification at temperatures up to 150°C to screen out latent defects prior to die bonding. Featuring rapid heating within tens of seconds and precision thermal control within ±1°C, the system meets the most demanding thermal specifications of advanced semiconductor processes.

By conducting electrical tests under near-operating thermal conditions, Centrum Technology helps manufacturers reduce downstream packaging failure risks, eliminate expensive post-assembly scrap costs, and maximize mass-production yield and reliability for advanced AI packaging products.