Laser Via Bottom AOI

【Development Background】

As substrate layer counts increase, blind via quality has a greater impact on AI system stability and signal integrity. Current inspection machines lack the speed required for full inspection. To address this, we developed a next-generation inspection system with significantly enhanced scanning efficiency.

【Technical Highlights】

-Scanning speed up to 300 mm/s.
-Compatible with various materials including ABF substrates, CCL, and PCB.