IC載板
高精度尺寸量測
【開發背景】
AI產品推動IC載板/PCB厚度持續增加,對切割與邊緣品質控制更為嚴苛。為此,我們開發一套高速、全尺寸量測系統以支援產線良率提升。
【技術亮點】
– 精度達 ±5 μm,支援 正/背面尺寸、天地邊、切割邊緣、缺口孔位。
– 可建置預警系統,預判刀具磨耗並協助維護時機管理。
HIGH ACCURACY DIMENSION MEASUREMENT
【Development Background】
We offer fully customized high-precision fixtures required for electrical testing and metrology processes, supporting customers in building stable and reliable process platforms.
【Technical Highlights】
-Capable of developing BUMP 3D measurement platforms with precision <1 μm.
-Provides a variety of high-strength glass fixtures and tooling for special applications.