IC載板
玻璃基板量測
【開發背景】
因應客戶開發玻璃基板製程,提供高精度量測設備,以協助其掌握可靠性與製程品質,提前達成量產規範。
【技術亮點】
可針對 尺寸、輪廓、孔徑、孔深、高溫翹曲（Warpage）等進行高速精密量測。
Glass Substrate Measurement
【Development Background】
To support customers in the development of glass substrate processes, we offer high-precision metrology solutions that help ensure reliability and process quality—facilitating early compliance with mass production standards.
【Technical Highlights】
High-speed, high-precision measurements for Dimensions, profiles, hole diameter, hole depth, and high-temperature warpage.