IC載板
加熱電測機
【開發背景】
針對AI高端封裝需求，為防止晶片組裝後才發現IC載板缺陷，設計具加熱功能的電測系統，在125°C條件下進行預先電測，提高產品可靠性。
【技術亮點】
– 數十秒內快速加熱至 125°C。
– 控溫精度達 ±1°C，對應先進製程嚴苛溫控要求。
HEATING OPEN SHORT TESTER
【Development Background】
To address the demands of AI advanced packaging, a heated electrical testing system was developed to detect IC substrate defects prior to chip assembly. By performing pre-screening at 125°C, the system significantly enhances product reliability and yield.
【Technical Highlights】
-Rapid heating to 125°C within tens seconds.
-Temperature control precision of ±1°C, meeting strict thermal requirements of advanced manufacturing processes.