半導體
MOLDING後WB-BGA線歪斜檢測
針對如車載類需高可靠度的IC檢測。
- IC 封裝最終階段測試，有效檢測封裝內部導線錯位問題。
- 採用與 Keysight 差異化的偵測方法，展現同級領先實力。
- 強化出貨後產品可靠性，降低終端用戶端潛在故障風險。
- 可廣泛應用於 ATV（車載產品）或需高可靠度的 IC 檢測。
WB-BGA Wire Skew Inspection after Molding
Reliable IC inspection targeting automotive-grade reliability standards.
- Final IC package inspection to detect internal wire misalignment issues.
- Utilizes a differentiated detection method compared to Keysight, demonstrating industry-leading performance in its class.
- Enhances post-shipment product reliability, reducing failure risk at the end user.
- Applicable to high-reliability ICs used in automotive (ATV) and similar applications.