HEATING OPEN SHORT TESTER

【Development Background】

To address the demands of AI advanced packaging, a heated electrical testing system was developed to detect IC substrate defects prior to chip assembly. By performing pre-screening at 125°C, the system significantly enhances product reliability and yield.

【Technical Highlights】

-Rapid heating to 125°C within tens seconds.
-Temperature control precision of ±1°C, meeting strict thermal requirements of advanced manufacturing processes.