半導體
3D檢量測系統
3D檢量測系統
興城提供不同精度的3D檢量測方案，提供半導體與封裝製程中，任何需要進行3D檢測的缺陷。
系統特性
- 超高解析度與高產能檢測 ( 可依客戶規格要求客製 )。
- 3 μm 級 Z 軸解析，符合高標準製程。
- 即時檢測，防止良率損失。
- 數據精準量化，降低誤判。
- 檢測表面缺陷 3D 輪廓，搭配 Profile 曲線呈現。
- AI 智能判別選配，強化自動化檢測。
- 客製化設備結構配置規劃。
適用場域
- 測量 Underfill 點膠寬度、高度與流動性，支援周邊與被動元件同步檢查。
- 翹曲檢查。
- Wire Bond 線寬、弧高。
- Bump 高度、尺寸、平整度。
- SMT 立碑、Shift、缺件異常。
- Socket 異常、錫附著、磨耗偵測。
- 任何立體物件之檢量測。
High Accuracy 3D Underfill Measurement
3D Inspection System
We offer a range of high-precision 3D inspection solutions for semiconductors and OSATs to meet any 3D inspection need in production.
System Features:
- Ultra-high resolution and high throughput detection (customizable to meet customer standards).
- 3μm Z-axis resolution can meet advanced process requirements.
- Real-time detection to prevent defects in the process.
- Quantitative data analysis to reduce false positives.
- 3D surface defect detection provides contour data.
- Use AI to assist defect classification to enhance auto-Inspection.
- Customizable device configurations and layouts.
application:
- Underfill width, height and fluidity of the bottom fill dispensing, and Inspection of surrounding components.
- warpage detection.
- Wire bond height and radian inspection.
- Bump height, size and coplanarity.
- SMT passive component tombstones / billboards and shift inspection.
- Socket pin abnormality, tin loss, and wear detection
- Measurement of any 3D object.