In 2.5D/3D advanced packaging (RDL) and C4 bump processes, aggressive scaling of line width/line space (L/S) alongside ultra-high bump density pushes conventional contact probe cards to their physical limits—triggering critical risks such as trace scratching, mechanical pad damage, metal layer punch-through, and severe probe wear.
Centrum Technology is currently developing the RDL & C4 Layer Non-Contact Electrical Testing Technology. Utilizing an innovative non-destructive electrical sensing mechanism, the system achieves zero-contact precision detection of open/short defects. This guarantees the electrical integrity of mission-critical redistribution layers (RDL) while effectively eliminating costly downstream process fallout and material scrap.
- Innovative Non-Contact Electrical Sensing Technology: Zero physical damage to wafer surfaces and fine-pitch metal traces.
- Engineered for High-Density RDL & C4 Layer Open/Short Inspection: Delivers high-precision detection for fine-line patterns and micro-bumps.
- Early-Stage Electrical Defect Interception: Drastically slashes downstream packaging yield loss and consequential manufacturing costs.