Semiconductor:Advanced Electrical Test for Embedded Substrates & Interposers
Precision Characterization of Interposer Embedded Structures: Supporting High-Volume Manufacturing (HVM) for Advanced CoWoS Packaging
Centrum Technology’s advanced electrical test and metrology solution combines proprietary electrical testing ASIC technology, multi-frequency LCR measurement, and high-precision optical alignment for embedded substrates and interposers. The system supports fine-pitch structures with bump sizes below 20 µm, providing stable and accurate electrical characterization for high-density advanced packaging applications.
Designed for CoWoS, 2.5D/3D heterogeneous integration, and AI/HPC packaging, the solution supports in-line process control, helps identify electrical and structural abnormalities before downstream assembly, reduces scrap risk, and strengthens yield and manufacturing reliability in high-volume production.
Core Technology Highlights
- Proprietary In-House Electrical Testing ASIC: Delivers high-speed, ultra-precise electrical metrology.
- Built-in High-Precision Multi-Frequency LCR Module: Ensures accurate, low-noise, interference-free measurement.
- Optimized Hardware Architecture: Minimizes parasitics and complex routing to maximize system stability.
- Precision Inspection for Micro-Bumps: Fully compatible with sub-20 µm interposer bump dimensions (< 20 µm).