Semiconductor : Non-Contact WB-BGA Wire Close Sweep sagging Inspection
Post-Mold Wire Sweep Inspection: Safeguarding High-Reliability IC Shipments
During transfer molding, mold-compound flow and process variation can cause wire sweep, wire sag, and insufficient wire-to-wire clearance in WB-BGA packages.
These hidden defects are difficult to detect using conventional automated visual inspection and may lead to latent short-circuit risks and field failures.
Centrum Technology’s non-contact, non-destructive inspection solution detects internal wire displacement after molding and supports 100% inspection before shipment. Designed for automotive and industrial-control ICs, it strengthens outgoing quality control (OQC), reduces inspection blind spots, and minimizes reliability risks in mission-critical applications.
Core Technology Highlights
- Sub-Surface Latent Defect Detection at Final Stage: Uncompromised detection capability for non-visible internal anomalies prior to outgoing release.
- High-Performance Wire Displacement & Wire-Close Classification: Precise identification and inspection of bonding wire sweep and proximity limits.
- Next-Generation Differentiated Inspection Architecture: Delivers industry-leading detection sensitivity and throughput.