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Ultra-High-Speed Develop proprietarily ASIC chip

IC Substrate:Ultra-High-Speed Develop proprietarily ASIC chip
Proprietary ASIC-Powered Electrical Testing Core: Delivering a High-Speed, High-Precision Open/Short Inspection Platform

The explosive growth of AI, advanced packaging, and ultra-high-density IC substrates presents stringent demands for open/short electrical testing in terms of speed, precision, and operational stability. As trace density escalates and test point counts surge, conventional electrical testing architectures become constrained by throughput bottlenecks, stability degradation, and limitations in high-voltage test capabilities.

Centrum Technology Ultra-High-Speed Open/Short Test & Inspection System is powered by a proprietary electrical test ASIC and advanced Tester Core Technology. Engineered specifically for IC substrates, IC packages, and fine-pitch interconnection traces, it delivers high-speed and ultra-accurate open/short testing. The platform boasts insulation resistance measurement capabilities up to 2 GΩ, a trace resistance test accuracy of 5 mΩ ±3%, and optional 300 V high-voltage electrical testing tailored for mission-critical applications.

Through proprietary electrical test core technology, Centrum Technology delivers not merely hardware, but an adaptable electrical test platform tailored to customer-specific process requirements. This empowers manufacturers to optimize 100% full-inspection throughput, eliminate defect escapes (under-kill), and reinforce the outgoing reliability of high-density substrate and packaging products.

Core Technology Highlights
  • Proprietary Electrical Testing Core: Equipped with in-house developed ASIC chips and exclusive Tester Core Technology.
  • Superior Insulation Resistance Testing Capability: Measurement range up to 2 GΩ.
  • Ultimate Resistance Measurement Precision: Delivers high accuracy down to 5 mΩ ±3%.
  • High-Voltage Electrical Testing for Advanced Applications: Supports up to 300 V high-voltage testing.