In response to the high power consumption, elevated thermal conditions, and high-density packaging demands of AI applications, the integration of embedded components within IC substrates continues to rise. While embedded components enhance electrical performance and packaging density, they significantly increase testing complexity—rendering conventional standalone open/short testing insufficient to address comprehensive component measurement needs.
Centrum Technology Embedded Component Test System integrates an advanced LCR measurement module into the electrical test platform, simultaneously supporting both open/short inspection and embedded component electrical testing. Through this integrated architecture, manufacturers can execute multiple electrical tests on a single platform, drastically minimizing tool changeovers and process idle time.
This solution empowers customers to enhance test throughput, ensure measurement consistency, and eliminate the risk of embedded component defects escaping into downstream processes—making it ideal for high-density IC substrates and advanced AI packaging applications.
- Integrated Hybrid Architecture: Seamlessly combines high-speed open/short testing with embedded electrical characterization.
- Built-in Precision LCR Module: Broad measurement capability ranging from 5 pF to 5 mF.