As AI chips and advanced packaging drive the continuous increase in IC substrate layer counts, blind via (microvia) quality has an increasingly critical impact on signal integrity, interconnection reliability, and long-term product dependability. Undetected bottom residue (smear), drilling anomalies, or process shifts can lead to downstream electrical failures, insertion losses, and catastrophic field defects in end applications.
Conventional blind via inspection systems are constrained by scanning throughput, making full inspection impractical under high-volume manufacturing conditions. Tailored for ABF substrates, CCL, and advanced PCBs, the Centrum Technology Blind Via Inspection System delivers high-speed via bottom AOI capabilities at scanning speeds up to 300 mm/s, dramatically maximizing inline full-inspection throughput.
This solution empowers manufacturers to gain real-time visibility into blind via quality across high-density substrate processes, eliminate the risk of micro-defects escaping into downstream processes, and reinforce the rigorous signal reliability and mass-production quality control required for high-performance AI computing products.
- Industry-Leading Ultra-High-Speed Scanning: Reaches scanning throughput speeds of up to 300 mm/s.
- Advanced Vision Algorithms: Purpose-built for the quantitative detection and identification of micro-via bottom defects and residues.
- Broad Material Adaptability: Fully optimized for ABF substrates, CCL (copper clad laminates), and high-end HDI PCBs.